Madhawa's Blog

i'm Madhawa Ranga following BSc. in Materials Science and Engineering at the University of Moratuwa.

Ama Akka’s Wedding March 30, 2009

Filed under: ama akka,wedding card — madhawa.h @ 6:41 pm

Ama akka who is a good friend of ours had her wedding yesterday (29th of march, 2009).
3 friends including me gave her a beautiful present. This is the greeting card which I made for attaching to it.

Outside of the card.

Inside of the card.

The image was from another site, and I edited it as my requirement.

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protect notepad files with a encrypted password March 28, 2009

Filed under: Uncategorized — madhawa.h @ 6:13 am

http://www.ziddu.com/downloadlink/4041766/LockNote.zip

 

A powerful task manager than the windows task manager

Filed under: portable task manager,powerfull tast manager — madhawa.h @ 6:12 am

http://www.ziddu.com/downloadlink/4041419/DTaskManager.zip

 

Protect ur privacy. Securely delete ur files

Filed under: Uncategorized — madhawa.h @ 6:11 am


http://www.ziddu.com/downloadlink/4041416/CyberShredder.zip


H.Madhawa Ranga
"No one knows what he can do till he tries."

 

make the Horescope of urs ur self.

Filed under: horoscope app,make horescope your self — madhawa.h @ 5:18 am

See ur future…
make the Horescope of urs ur self.
http://www.ziddu.com/downloadlink/309565/U_Horoscope.exe

 

Electron and X-ray microscopy March 26, 2009

Knowledge of the microscopic structure is essential for understanding the properties of materials and to design functional devices. Electron microscopy and X-ray imaging have been used for decades to ‘look’ inside matter. The articles in this Insight aim to illustrate some of the most outstanding advances in instrumentation and computation abilities of these techniques that have led to unprecedented precision in terms of spatial resolution and sensitivity to composition and physical properties.

 

IMAPS Panelists Address Tough 3-D Challenges March 20, 2009

Filed under: Uncategorized — madhawa.h @ 4:00 pm

TOP STORY… March 19, 2009

A panel of experts at the IMAPS Device Packaging Conference considered the challenges facing 3-D manufacturing, including the role of foundries, assembly and test vendors, EDA tool providers and equipment companies. IBM is planning to use 3-D IC technology in future products, with announcements expected soon, said IMAPS participant David Danovitch, a senior engineer at IBM's Bromont, Canada, facility.
Read more >>