Madhawa's Blog

i'm Madhawa Ranga following BSc. in Materials Science and Engineering at the University of Moratuwa.

IMAPS Panelists Address Tough 3-D Challenges March 20, 2009

Filed under: Uncategorized — madhawa.h @ 4:00 pm

TOP STORY… March 19, 2009

A panel of experts at the IMAPS Device Packaging Conference considered the challenges facing 3-D manufacturing, including the role of foundries, assembly and test vendors, EDA tool providers and equipment companies. IBM is planning to use 3-D IC technology in future products, with announcements expected soon, said IMAPS participant David Danovitch, a senior engineer at IBM's Bromont, Canada, facility.


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